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From: "Design Engineers Bulletin" <design_engineers@eb.emediausa.com>
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Subject: Includes: 11 Reasons for BER & COM Source Differences
Date: Fri, 17 Jun 2016 06:15:00 -0700
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Design Engineers Bulletin


We value your opinion click here to provide feedback  
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In this Issue

 
Shortfalls of 2D Manufacturing 

 
Verifying High-Performance PLLs and SerDes 

 
11 Reasons for BER & COM Source Differences 

 
Avoiding Reed Relay Problems 

 
Drastically Reduce Manufacturing Flaws 


Shortfalls of 2D Manufacturing

Product development has embraced the benefits of 3D CAD solutions for 
years. However, many organizations are still using 2D paper drawings to 
convey the information needed for manufacturing. Learn in this white paper 
the many ways model-based definition (MBD) helps manufacturers.


Download now

http://mailing.emedia-us.com/t/1899409/66375645/6507436/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=6ba2ff0d 


Verifying High-Performance PLLs and SerDes

As semiconductor product specifications grow ever more demanding, 
trade-offs between performance, power and area frequently require 
custom-optimized solutions not found with traditional off-the-shelf IP 
offerings. This paper discusses how the AFS Platform from Berkeley Design 
Automation has enabled Silicon Creations to improve its analog and 
mixed-signal circuit design signoff flow significantly, while increasing 
design productivity and reducing risk.


Download now

http://mailing.emedia-us.com/t/1899409/66375645/6507437/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=485ccdeb 


11 Reasons for BER & COM Source Differences

There are a number of differences between the computational procedure 
specified for Channel Operation Margin (COM) compared to the traditional 
statistical eye/BER analysis. This paper demonstrates how COM analysis is a 
simplified version of the statistical simulation of SERDES links. With all 
conditions being set equal, the two give very close, if not identical, 
results.


Learn more

http://mailing.emedia-us.com/t/1899409/66375645/6507438/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=372e89be 


Avoiding Reed Relay Problems

Reed relays are often considered a mundane component by design engineers 
and sometimes little thought is given to the finer points of their 
specifications. If used correctly, reed relays are very reliable devices. 
Discover how to avoid common problems to greatly enhance the reliability 
and performance of your designs.


Read now

http://mailing.emedia-us.com/t/1899409/66375645/6507439/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=bee7242d 


Drastically Reduce Manufacturing Flaws

3D printing is applied across diverse fields including aerospace, 
automotive, electronics, medical and education. It is revolutionizing many 
fields and disciplines, demonstrating that almost every industry could 
benefit in some way from this technology. This paper explores 3D printing’s 
revolution in today’s world and beyond. 


Download now

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<td><span style="color: #f5f5f5; font-size: xx-small;">In this issue of Design Engineers Bulletin:<br>Shortfalls of 2D Manufacturing<br />
Verifying High-Performance PLLs and SerDes<br />
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<td style="line-height: 18px; padding-right: 10px; font-family: Arial, Helvetica, sans-serif; color: #202020; font-size: 13px;" align="left" 
valign="top">Product development has embraced the benefits of 3D CAD solutions for years. However, many organizations are still using 2D paper 
drawings to convey the information needed for manufacturing. Learn in this white paper the many ways model-based definition (MBD) helps manufacturers. 
<a style="font-family: Arial, Helvetica, sans-serif; color: #202020; font-size: 13px; font-weight: bold; text-decoration: underline;" 
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<td style="line-height: 18px; font-family: Arial, Helvetica, sans-serif; color: #202020; font-size: 13px;" align="left" valign="top"> <a 
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href="http://mailing.emedia-us.com/t/1899409/66375645/6507441/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=4a96d0b3" 
target="_blank">Shortfalls of 2D Manufacturing&nbsp;&nbsp;&gt;&gt;</a><br>   <a style="line-height: 18px; font-family: Arial, Helvetica, sans-serif; 
color: #202020; font-size: 12px; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507442/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=1a5ed342" 
target="_blank">Verifying High-Performance PLLs and SerDes&nbsp;&nbsp;&gt;&gt;</a><br>  <a style="line-height: 18px; font-family: Arial, Helvetica, 
sans-serif; color: #202020; font-size: 12px; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507443/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=c1875b77" 
target="_blank">11 Reasons for BER &amp; COM Source Differences&nbsp;&nbsp;&gt;&gt;</a><br>  <a style="line-height: 18px; font-family: Arial, 
Helvetica, sans-serif; color: #202020; font-size: 12px; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507444/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=4df3c2af" 
target="_blank">Avoiding Reed Relay Problems&nbsp;&nbsp;&gt;&gt;</a><br>  <a style="line-height: 18px; font-family: Arial, Helvetica, sans-serif; 
color: #202020; font-size: 12px; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507445/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=3821b4ca" 
target="_blank">Drastically Reduce Manufacturing Flaws&nbsp;&nbsp;&gt;&gt;</a><br> </td>
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#202020; font-size: 13px;" align="left" valign="top" bgcolor="#ffffff">As semiconductor product specifications grow ever more demanding, trade-offs 
between performance, power and area frequently require custom-optimized solutions not found with traditional off-the-shelf IP offerings. This paper 
discusses how the AFS Platform from Berkeley Design Automation has enabled Silicon Creations to improve its analog and mixed-signal circuit design 
signoff flow significantly, while increasing design productivity and reducing risk. <a style="font-family: Arial, Helvetica, sans-serif; color: 
#202020; font-size: 13px; font-weight: bold; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507437/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=485ccdeb" 
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padding-top: 15px;" align="left" valign="top" bgcolor="#ffffff"><strong><a style="font-weight: bold; text-decoration: underline; font-family: Arial, 
Helvetica, sans-serif; color: #00004e; font-size: 20px;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507438/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=372e89be" 
target="_blank">11 Reasons for BER &amp; COM Source Differences</a></strong></td>
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href="http://mailing.emedia-us.com/t/1899409/66375645/6507438/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=372e89be" 
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#202020; font-size: 13px;" align="left" valign="top" bgcolor="#ffffff">There are a number of differences between the computational procedure specified 
for Channel Operation Margin (COM) compared to the traditional statistical eye/BER analysis. This paper demonstrates how COM analysis is a simplified 
version of the statistical simulation of SERDES links. With all conditions being set equal, the two give very close, if not identical, results. <a 
style="font-family: Arial, Helvetica, sans-serif; color: #202020; font-size: 13px; font-weight: bold; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507438/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=372e89be" 
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padding-top: 15px;" align="left" valign="top" bgcolor="#ffffff"><strong><a style="font-weight: bold; text-decoration: underline; font-family: Arial, 
Helvetica, sans-serif; color: #00004e; font-size: 20px;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507439/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=bee7242d" 
target="_blank">Avoiding Reed Relay Problems</a></strong></td>
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#202020; font-size: 13px;" align="left" valign="top" bgcolor="#ffffff">Reed relays are often considered a mundane component by design engineers and 
sometimes little thought is given to the finer points of their specifications. If used correctly, reed relays are very reliable devices. Discover how 
to avoid common problems to greatly enhance the reliability and performance of your designs. <a style="font-family: Arial, Helvetica, sans-serif; 
color: #202020; font-size: 13px; font-weight: bold; text-decoration: underline;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507439/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=bee7242d" 
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padding-top: 15px;" align="left" valign="top" bgcolor="#ffffff"><strong><a style="font-weight: bold; text-decoration: underline; font-family: Arial, 
Helvetica, sans-serif; color: #00004e; font-size: 20px;" 
href="http://mailing.emedia-us.com/t/1899409/66375645/6507440/0/?301bfbbf=NTIwODA5Nw%3d%3d&7fb2ef93=NzkyMDA5MQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&e5e2987d=MTg5OTQwOQ%3d%3d&c73c8e04=ZGVuZ24%3d&4f415564=NjYzNzU2NDU%3d&x=ef242d54" 
target="_blank">Drastically Reduce Manufacturing Flaws</a></strong></td>
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#202020; font-size: 13px;" align="left" valign="top" bgcolor="#ffffff">3D printing is applied across diverse fields including aerospace, automotive, 
electronics, medical and education. It is revolutionizing many fields and disciplines, demonstrating that almost every industry could benefit in some 
way from this technology. This paper explores 3D printing&rsquo;s revolution in today&rsquo;s world and beyond. <a style="font-family: Arial, 
Helvetica, sans-serif; color: #202020; font-size: 13px; font-weight: bold; text-decoration: underline;" 
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